Glossary
76 hardware terms defined โ from basics to advanced concepts.
An efficiency certification. Gold = 87-92% efficient. Platinum = 90-94%. Titanium = 92-96%.
The maximum data transfer rate of a connection. Measured in Mbps or Gbps.
The maximum data transfer rate between two components. Measured in GB/s for internal connections.
The process of testing chips after fabrication and sorting them by quality. Better chips become higher-SKU products.
Basic Input/Output System โ firmware stored on a ROM chip that initializes hardware and boots the OS.
The maximum turbo frequency a CPU reaches on lightly threaded workloads when power and thermal headroom allow.
When one component limits the performance of another โ most commonly CPU limiting GPU utilisation in games.
Ultra-fast on-chip SRAM memory in L1, L2, and L3 tiers. L1 is fastest (KB range), L3 is largest (MB range).
An energy storage component that smooths voltage fluctuations. PSUs use Japanese capacitors for reliability.
CL โ the number of clock cycles between a memory request and data delivery. Lower is faster.
A modular CPU design where separate dies (compute, I/O) are combined in one package. Used in AMD Ryzen.
The number of cycles a CPU executes per second, measured in GHz. Modern CPUs boost between 3.5โ6.0 GHz.
Complementary Metal-Oxide Semiconductor โ a small SRAM chip powered by a coin cell battery storing BIOS settings.
An independent processing unit within a CPU die. Modern CPUs have 6โ24 cores for consumer use.
Central Processing Unit โ the primary chip that executes program instructions using a fetch-decode-execute cycle.
NVIDIA's name for shader processors โ the parallel computing units that execute rendering calculations.
Previous RAM standard running at 2133โ4800 MT/s. Still supported on older platforms.
Double Data Rate 5 โ current RAM standard. Runs at 4800โ8000+ MT/s with on-die ECC. Requires AM5 or LGA1700.
The actual silicon chip containing transistors. A CPU package may contain one or more dies (chiplets).
Deep Learning Super Sampling โ NVIDIA's AI upscaling that renders at lower resolution and upscales to target.
A small DRAM chip on the SSD used to store the Flash Translation Layer for faster random access.
Installing RAM in matched pairs in A2+B2 slots doubles the memory bus from 64-bit to 128-bit.
Error-Correcting Code memory โ detects and corrects single-bit errors automatically.
Wired network connection via RJ45 port. 1GbE is standard; 2.5GbE is common on modern boards.
Extended Profiles for Overclocking โ AMD's equivalent of XMP for AM5 platforms.
Physical size standard: ATX, mATX, ITX for motherboards; 3.5", 2.5", M.2 for storage.
A region of VRAM storing the current rendered frame before it is sent to the display.
AMD's open adaptive sync standard. Works with NVIDIA GPUs as "G-Sync Compatible" on certified panels.
FidelityFX Super Resolution โ AMD's open-source spatial upscaling technology, works on any GPU.
NVIDIA's adaptive sync technology syncing monitor refresh rate to GPU frame rate, eliminating tearing.
Graphics Processing Unit โ a massively parallel processor designed to render images and handle compute workloads.
Hard Disk Drive โ magnetic spinning platter storage. Slow but offers high capacity at low cost per GB.
High Dynamic Range โ wider luminance range between darkest and brightest points. DisplayHDR 1000 = 1000 nits peak.
Integrated Memory Controller โ the circuit inside the CPU that manages RAM communication. Replaced the North Bridge.
Instructions Per Clock โ how much work a CPU completes in a single cycle. Higher IPC = faster per GHz.
In-Plane Switching โ LCD panel technology with excellent color accuracy and wide viewing angles.
The industry standard body that defines base memory specifications. DDR5-4800 is the JEDEC base spec.
The delay between sending a request and receiving a response. Measured in milliseconds (ms).
The delay between requesting and receiving data. Lower is better. Measured in nanoseconds for RAM.
A compact form factor for SSDs that plugs directly into the motherboard. Supports both NVMe and SATA.
A PSU where cables are detachable โ only connect what you need, reducing cable clutter.
The flash memory type used in SSDs. Types include TLC (3 bits/cell), QLC (4 bits/cell), and MLC (2 bits/cell).
Non-Volatile Memory Express โ a protocol for SSDs using PCIe lanes. Much faster than SATA.
Organic LED โ self-emissive pixels that turn fully off. Infinite contrast, instant response, perfect blacks.
Running a CPU above its rated clock speed by increasing voltage and multiplier settings in BIOS.
Peripheral Component Interconnect Express โ the high-speed serial bus connecting GPU to CPU. Current standard is PCIe 5.0.
A single bidirectional serial link in the PCIe bus. x1 = 1 lane, x4 = 4 lanes, x16 = 16 lanes.
Pixels per inch (PPI). Higher PPI = sharper image. 27" 4K = 163 PPI; 27" 1440p = 109 PPI.
Power-On Self-Test โ the BIOS routine that checks hardware (CPU, RAM, GPU) before handing off to the OS.
Power Supply Unit โ converts 120/240V AC wall power into DC rails (12V, 5V, 3.3V) for components.
A voltage output line from the PSU. The 12V rail powers CPU and GPU; 5V and 3.3V power other components.
Random Access Memory โ volatile DRAM that stores actively used data for the CPU. Loses all content when powered off.
The traditional rendering method converting 3D geometry to 2D pixels. Faster than ray tracing.
A rendering technique simulating real light physics by tracing rays from the camera into the scene.
How many times per second the monitor redraws its image. 60Hz, 144Hz, 240Hz, 360Hz are common.
The number of pixels: 1080p (1920ร1080), 1440p (2560ร1440), 4K (3840ร2160).
How fast a pixel changes color, measured in ms. Lower = less motion blur and ghosting.
Red Green Blue LEDs embedded in components and cases for aesthetic lighting effects.
Serial ATA โ a storage interface capped at ~550 MB/s. Used by 2.5" SSDs and HDDs.
The physical interface between CPU and motherboard. AM5 (AMD) and LGA1700 (Intel) are current standards.
Solid State Drive โ flash-based storage with no moving parts. Fast, silent, and shock-resistant.
AMD's equivalent of CUDA cores โ shader processors in RDNA architecture GPUs.
TeraBytes Written โ the total data a drive is rated to write before wear becomes a concern.
Thermal Design Power โ the heat a cooler must dissipate to keep the CPU at spec. Measured in watts.
A thermally conductive compound filling microscopic gaps between CPU IHS and cooler base.
Automatic CPU/GPU clock reduction when temperatures exceed safe limits to prevent damage.
A virtual core created by Hyper-Threading (Intel) or SMT (AMD) allowing one physical core to handle two instruction streams.
Twisted Nematic โ the oldest LCD type. Fast response but poor color and viewing angles.
Unified Extensible Firmware Interface โ the modern BIOS replacement with GUI, mouse support, and Secure Boot.
Vertical Alignment โ LCD type with the best contrast ratio (3000:1+) but slower response times.
Electrical potential difference driving current through circuits. CPUs operate at ~1.0-1.4V core voltage.
Video RAM โ dedicated high-bandwidth memory on the GPU storing textures, frame buffers, and geometry data.
Voltage Regulator Module โ converts 12V PSU power to the precise low voltage (0.7โ1.5V) the CPU needs.
The rate of electrical power consumption. A 450W GPU draws 450 joules of energy per second.
IEEE 802.11ax extended โ adds 6GHz band for less congestion, up to 9.6 Gbps theoretical.
Extreme Memory Profile โ Intel's specification for enabling RAM to run above JEDEC base speeds via BIOS profile.